水辅助激光微通道

以水为介质进行皮秒激光烧蚀，在氧化锆陶瓷上加工出U形截面微通道，重铸层和裂纹基本消除。

景秀并 · 王军义 · 宋晓菲 · Yun, Chen · Husain Jaffery, Syed Imran

Ceramics International 2023

参数信息

微通道深度

52.74 %

氧空位含量

50.01 %

单斜相含量

12.7 %

四方相含量

58.8 %

技术优势

少热损伤

Water-assisted ablation leaves a porous surface with almost no recast layer and cracks, reducing post-processing.

截面更优

Water-assisted ablation yields a U-shaped profile with 52.74% greater depth than the V-shaped profiles from DLA and LALA-E, improving flow characteristics.

缺陷更少

Water-assisted ablation results in the lowest oxygen vacancy content (50.01% vs 53.81% for DLA), suggesting reduced surface damage.

相变较小

Water-assisted ablation leads to the smallest increase in monoclinic phase (from 9.9% to 12.7%) and the highest tetragonal phase content (58.8%), preserving mechanical properties.

应用场景

• 陶瓷微加工：用无重铸层、无裂纹的水辅助工艺替代传统干法刻蚀陶瓷。
• 微流控芯片：U形截面和更深微通道改善流场均匀性，适合制作陶瓷基微流控芯片。
• 精密激光加工：提高52.74%的深度而不牺牲表面质量，满足精密激光加工需求。
• 陶瓷基微器件：保留更多四方相，维持力学性能，适用于高可靠性陶瓷微器件。